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4-Layer MTK8172 MID
The PCB design of the 4-layer MTK8172 MID focuses on creating a compact and efficient layout for the device. It involves careful planning of the circuitry to ensure optimal performance and signal integrity. The design process includes selecting appropriat
Layers：4Layers
Minimum Width and Spacing：4/4mil
Design Tools：Cadence Allegro
Design Cycle：7 days
Modules：MTK8172、DDR3、EMMC、USB、PMU
