Technical support
| Layer count |
4L | 2L | 6L | 6L | 8L | 10L | 12L | 14L | 16L |
|---|---|---|---|---|---|---|---|---|---|
| Layer Structure |
 |
|
|
|
|
|
|
|
|
| product type |
Depth control drill |
Copper base PCB |
Buried copper inlaid |
1 + N HDI, Buries holes |
Mechanical back drilling Etching back drill |
2 + N HDI, POFV | Heavy, copper |
Countersink head holes |
High layer count |
| Item | Manufacture Capability | Manufacture Capability |
|---|---|---|
| Layer | 2-30 Layer | 2-30 Layer |
| Thickness | 0.3-3.5 mm | 0.2-5.0 mm |
| Laminate Type | FR-4、High TG | PTFE、PTFE |
| Copper Foil Thickness | 1/3-6 oz | 1/3-14 oz |
| Min.Line Width/Space | 75 um/75 um | 50 um/60 um |
| Min. Through hole diameter | 0.15 mm | 0.15 mm |
| Micro channel thickness ratio | 12:1 | 15:1 |
| Min. Blind hole diameter | 4 mil | 4 mil |
| Blind aperture ratio | 0.7:1 | 1:1 |
| Min. Dielectric thickness | 50 um | 25 um |
| Wiring layer | 2+N+2 | 3+N+3 |
| Surface Finish | HASL，ENIG，Immersion Tin，Immersion Silver，OSP | |
