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FYPCB Factory is a specialist in the production of multilayer PCBs, prototyping, impedance boards, and HDI boards, including blind and buried hole board prototyping, as well as small batch production. The company operates two major production facilities, located in Shenzhen and Jiujiang
FYPCB is equipped with environmental protection credentials and has achieved several quality management system certifications. The company has established and rigorously follows SOP (Standard Operating Procedure) production standards, ensuring quality management that surpasses industry norms.
Single-Sided Boards
Double-Sided Boards
Multi-Layer Boards
HDI PCBs
Thick Copper PCB
High TG PCBs
Flexible PCBs
Rigid-flex PCBs
High Frequency PCBs
Metal-core PCBs
Aluminum PCBs
LED PCB
Ceramic PCBs
Microwave PCBs
Gold Finger PCBs
Equipped with a large-scale production facility, FYPCB is adept at managing a variety of orders concurrently.
The company excels in both small-batch custom manufacturing and large-scale standardized production, ensuring efficient completion.
This extensive production capacity not only reduces per-unit manufacturing costs but also accelerates delivery times, thereby satisfying the diverse demands of clients worldwide.
FYPCB's FR4 raw materials are exclusively sourced from high-quality A-grade military specification laminates from Kingboard and Shengyi.
Imported inks ensure clear and vibrant solder mask printing, guaranteeing the supply quality of the products.
FYPCB places a strong emphasis on quality control, with the factory equipped with comprehensive ISO 9001, ISO 14001, ISO 16949, ISO 13485, and UL quality management system certifications.
The products comply with RoHS environmental requirements. The company conducts rigorous quality inspections at every production stage to ensure that the products meet customer requirements and international standards.
FYPCB possesses extensive experience and expertise in PCB design, routing, printing, drilling, and gold plating.
By offering a one-stop service that seamlessly integrates design and production, we significantly reduce our customers' R&D cycles.
FYPCB's products are widely applied across various fields, including industrial control electronics, communication electronics, automotive electronics, consumer electronics, security electronics, and medical electronics.
The company's product quality has been highly recognized by customers and has successfully established solid cooperative relationships with several globally renowned enterprises.
| Titles | Capability | Details |
|---|---|---|
| Layers | 1-32 Layers | FYPCB: 1-32 Layer PCBs |
| Maximum Dimensions | 500x1100mm | Standard panel size: 550x420mm. Exceeding this is considered an oversize panel. |
| Footprint Tolerance | ±0.2mm | CNC Tolerance ±0.2mm, V-cut Tolerance ±0.5mm. |
| Board Thickness Tolerance | ±0.1mm | Due to production processes such as copper plating, solder mask, and pad plating, which can increase board thickness, the tolerance is generally on the positive side. |
| Finished Copper Thickness | 1OZ/2OZ/3OZ | Outer Layer Copper Thickness,1OZ＝35um,2OZ=70um,3OZ=105um |
| Inner Layer Copper Thickness | 35um/50um | Customizable inner layer copper thickness for 1.6mm and 2.0mm 4/6-layer PCBs. |
| Minimum Gap | 3mil（0.1mm） | 3mil line spacing, gaps ≥6mil; <6mil costs more. |
| Hole Diameter (Machine Drilled) | 0.15--6.3mm | Min. hole size: 0.15mm, max.: 6.3mm (oversize requires special handling). Min. PTH slot: 0.65mm; metal slots < 0.65mm enlarged to 0.65mm. Aluminum base min. hole: 0.8mm, slot: 1.2mm. Min. NPTH hole: 0.45mm; sizes < 0.45mm enlarged to 0.45mm. |
| Finished Hole Diameter (Machine Drilled) | 0.15--6.20mm | Hole diameters are typically less than specified due to copper plating on the walls. |
| Hole Tolerance (Machine Drilled) | ±0.08mm | Drilling tolerance: ±0.08mm. For a 0.6mm hole, finished sizes from 0.52mm to 0.68mm are acceptabl. |
| Min. Character Width | ≥0.15mm | Min. Char. Width: 0.15mm; below may be unclear. |
| Min. Character Height | ≥0.8mm | Min. Char. Height: 0.8mm; below may cause illegibility. |
| Character Aspect Ratio | 1:5 | Optimal width-to-height ratio for production. |
| Trace to Outline Clearance | ≥0.3mm（12mil） | Routing clearance: min. 0.3mm from outline; V-score: min. 0.4mm from centerline. |
| Gapless Panel Stitching | Zero Gap Paneling | Zero-gap Panel Assembly for Delivery |
| Gapped Panelization | 1.6mm | Gapped Panel: Gap ≥1.6mm; less may cause routing difficulties. |
| Minimum Half-Hole Diameter | 0.6mm | Minimum Half-Hole Diameter: 0.6mm |
| Titles | Capability | Details |
|---|---|---|
| Materials | FR4 | TG135-TG170, Hal/CTI materials custom. |
| Layers | 4-16 Layers | Prototyping: 4-24 Layers, Production: 4-16 Layers. |
| Layer Stackup | 4+N+4 | Prototyping: Any Layer Interconnect |
| Minimum Line/Space | 2/2mil | / |
| Blind Hole Type | Mechanical Blind Vias: ≥0.15mm, Laser Blind Vias: ≥0.075mm. | Customizable, subject to evaluation. |
| Annular Ring Size | 2.5mil | / |
| Pad Copper | 12-18μm | Customizable, subject to evaluation. |
| PTH (Plate Through Hole) | 0.05-0.1mm,±15%. | PTH: Electroplate copper to fully metallize hole surfaces. |
| Blind Hole Aspect Ratio | 1:1 | / |
| Titles | Capability | Details |
|---|---|---|
| Layers | 1-12 Layers | Rigid-Flex PCB: 2 - 26 layers，FPC: 1 - 12 layers |
| Materials | FR-4, PI | FR-4 excels in electrical properties and high-temperature operation; PI is flame-resistant and temperature-stable. |
| Maximum Board Size | 1- 2 Layer：500 * 1200mm >=2 Layer：500 * 800mm | / |
| Tolerance for Outer Dimensions | CNC: ±5mil Laser: ±2mil | / |
| Finished Board Thickness | 0.10mm- 7mm | / |
| Minimum Board Thickness | Single-sided: 0.05mm 2-layer: 0.10mm | / |
| Board Thickness Tolerance | ±10% | / |
| Impedance Control | ±10% | / |
| Minimum Line Width/Spacing | Inner Layer： 1/3oz: 2/2mil Hoz: 3/3mil 1oz: 5/5mil 2oz: 5/7mil 3oz: 7/8mil 4oz: 10/10mil 5oz 12/12mil 6oz/ 15/12mil | Outer Layer： Hoz: 3/3mil 1oz: 4/4mil 2oz: 5/6mil 3oz: 7/8mil 4oz: 10/10mil 5oz: 12/12mil 6oz: 15/12mil |
| Outer Layer Copper Thickness | Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | 1OZ＝35um,2OZ=70um,3OZ=105um |
| Inner Layer Copper Thickness | 1/3oz, Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | 1OZ＝35um,2OZ=70um,3OZ=105um |
| Minimum Finished Hole Diameter | Mechanical Hole: 6mil Laser Hole: 3mil | Below this threshold, costs escalate or production becomes infeasible. |
| Inner Layer Alignment Tolerance | ±2mil | / |
| Minimum Annular Ring | Inner Layer： Hoz: 4mil 1oz: 6mil 2oz: 8mil 3oz: 12mil 4oz: 15mil 5oz: 18mil 6oz: 20mil | Outer Layer： Hoz: 4mil 1oz: 4/4mil 2oz: 5/6mil 3oz: 7/8mil 4oz: 10/10mil 5oz: 12/12mil 6oz: 15/12mil |
| Warpage Tolerance | ≤0.75% | PCB warpage is the unintended deviation from the planar form of a printed circuit board. |
| Titles | Capability | Details |
|---|---|---|
| Layers | 2-26 Layers | Rigid-Flex PCB: 2 - 26 layers，FPC: 1 - 12 layers |
| Materials | FR-4, PI | FR-4 excels in electrical properties and high-temperature operation; PI is flame-resistant and temperature-stable. |
| Maximum Board Size | 2-4 Layer：500 * 1000mm >=8 Layer：500 * 800mm | / |
| Tolerance for Outer Dimensions | CNC: ±5mil Laser: ±2mil | / |
| Finished Board Thickness | 0.10mm- 7mm | / |
| Minimum Board Thickness | 2-4 Layer: 0.25mm 6 Layer: 0.50mm | / |
| Board Thickness Tolerance | ±10% | / |
| Impedance Control | ±10% | / |
| Minimum Line Width/Spacing | Inner Layer： 1/3oz: 2/2mil Hoz: 3/3mil 1oz: 5/5mil 2oz: 5/7mil 3oz: 7/8mil 4oz: 10/10mil 5oz 12/12mil 6oz/ 15/12mil | Outer Layer： Hoz: 3/3mil 1oz: 4/4mil 2oz: 5/6mil 3oz: 7/8mil 4oz: 10/10mil 5oz: 12/12mil 6oz: 15/12mil |
| Outer Layer Copper Thickness | Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | 1OZ＝35um,2OZ=70um,3OZ=105um |
| Inner Layer Copper Thickness | 1/3oz, Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | 1OZ＝35um,2OZ=70um,3OZ=105um |
| Minimum Finished Hole Diameter | Mechanical Hole: 6mil Laser Hole: 3mil | Below this threshold, costs escalate or production becomes infeasible. |
| Inner Layer Alignment Tolerance | ±2mil | / |
| Minimum Annular Ring | Inner Layer： Hoz: 4mil 1oz: 6mil 2oz: 8mil 3oz: 12mil 4oz: 15mil 5oz: 18mil 6oz: 20mil | Outer Layer： Hoz: 4mil 1oz: 4/4mil 2oz: 5/6mil 3oz: 7/8mil 4oz: 10/10mil 5oz: 12/12mil 6oz: 15/12mil |
| Warpage Tolerance | ≤0.75% | PCB warpage is the unintended deviation from the planar form of a printed circuit board. |
| Material Types | Process Types | Surface |
| FR-4 | Ultra-thin PCBs | HASL |
| Aluminum PCBs | Thick copper | Immersion Gold |
| Flexible PCBs | Impedance | Immersion Silver |
| Ceramic PCBs | HDI PCBS | Immersion Tin |
| High TG PCBs | Gold Fingers | Gold Plated |
| High-frequency | Halogen-Free | NiPdAu |
| Metal-core PCBs | Carbon Oil | Bare Copper |
| Rigid-flex PCBs | BGA Via-In-Pad | OSP |
We specialize in a range of unique materials, advanced processes, and diverse surface treatments that set us apart from the competition. Our expertise allows us to accommodate the most sophisticated and specific customization requirements, ensuring that your project's needs are not only met but exceeded. Whether you're looking for unconventional materials, innovative manufacturing techniques, or specialized finishing options, we are committed to delivering tailored solutions that bring your vision to life.
There are several compelling reasons why you should choose our PCB manufacturing service:
Printed Circuit Boards
Surface
