[SMT Factory] Automatic Depaneling Machine
FYPCB:Global PCB Design&Layout Provider
One-stop Service for Schematic Diagram Design, PCB Design&Layout, PCB Fabrication, PCB Assembly
Professional
01005 (0402) size parts, 0.2mm pitch BGAsDelivery time
Over 600k local stock for extra fast turnaround.Convenient
One-stop service with our own factoryService
Reflow soldering, Wave solderingFYPCB operates a 15,000㎡ SMT/PCBA facility with cutting-edge equipment, featuring 36 Siemens E-series pick-and-place machines on our SMT lines. Equipped with advanced inspection tools like SPI, AOI, and X-ray, we follow standardized processes and allocate production lines efficiently for both mass and prototype runs. Our daily output surpasses 98 million components, enabling us to fulfill customized PCBA needs across various industries.
Consumer Electronics
Telecommunications Industry
Industrial Control and Automation
Automotive Electronics
Aerospace and Defense
Computers and Data Storage
Smart Home
Lighting Systems
Medical Electronics
GKG fully automatic printing machine, Sitec 2D/3D SPI, new Siemens E-series surface mount machine, 10-12 temperature zone air reflow soldering and nitrogen reflow soldering, rectangular AOI detector, 2D/3D X-ray inspection fully automatic first piece inspection instrument, selective wave soldering, BGA repair table
SMT | Capability |
---|---|
PCB Size | 50 x 50mm - 510 x 460mm |
PCB board thickness | 0.3mm~4.5mm |
PCB Material | Flex, Rigid, Rigid-Flex PCBs. |
Assembly type | Reflow Soldering, Wave Soldering, Hybrid Soldering. |
Component Size | 01005 (imperial) to 45mm x 98mm |
Component Spacing | Min. IC pitch: 0.25mm, Min. BGA pitch: 0.25mm. |
Component Height | Up to 19mm |
Placement Accuracy | ±41μm for chip, ±37.5μm for IC. |
Placement Capacity | 98 million points per day |
Imported specialized equipment, online polishing technology, innovative capabilities, and ISO 9000 certification - the consistent choice of over 12,000 customers.
Using imported steel sheets
Strong tensile strength, good smoothness, toughness, and not easily broken The thickness ranges from 0.03mm to 1.0mm, with an accuracy of up to ± 0.005mm
High-Precision Laser Cutting Equipment
Equipped with a comprehensive combination of multiple processes, high cutting accuracy, fast speed, and good quality
Polishing process
Polishing and Buffing: Smoothing the steel plate surface to remove burrs from the hole walls. Electrolytic Polishing: Improved solder deposition after electrolytic polishing.
Choose FYPCB to Accelerate Your R&D Process.
We have passed certifications such as IATF 16949, ISO 13485, ISO 9001, and ISO 14001. Our entire process is managed using the MES (Manufacturing Execution System), ensuring top-tier product quality through automated, intelligent, and systematic production management mechanisms, which results in customer satisfaction.
With a professional team of nearly 200 members, including engineering technology and quality control, who possess over 10 years of experience, 40% of our team members have served renowned companies in the industry such as Huawei, Bell, Shennan Circuit, TCL, BYD, and Jabil.
In terms of team structure, in addition to our professional technical team, we also have an innovative management team with an average of 12 years of experience, dedicated to process optimization, technological advancement, and improvement in manufacturing processes.